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　　RA300L high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This product was designed to o?er exceptional electrical and mechanical stability at competitive price.

　　RA300L materials exhibit a coefficient of thermal expansion (CTE) in the X and Y axis of 8 ppm/℃, The Z-axis CTE is 20 ppm/ °C, which provides exceptional plated through-hole reliability, even in severe thermal environments.

　　RA300L laminates can be fabricated into printed circuit boards using standard PTFE circuit board processing techniques. 

　　RA300L laminates are frequently used in Automotive Radar，Global Positioning Satellite Antennas, Cellular Telecommunications Systems—Power Amplifiers and Antennas, Patch Antenna for Wireless Communications, Direct Broadcast Satellites and Datalink on Cable Systems.

RA300L TDS

RA300L processing Instruction. PDF