- Business Unit
Interconnect solution
High-frequency high-speed seri
Other solutions
Interconnect solution
High-frequency high-speed seri
Other solutions
Interconnect solution
High-frequency high-speed seri
Other solutions
Features and Benefits:
?Low dielectric constant ( @10GHz Dk 3.20)and dissipation (@10GHz Df 0.0030)
?High glass transition temperature(Tg 280℃)
?Low press temperature 180℃
?Reliable multiple press characteristics
?Good blind hole filling effect
?Excellent thickness uniformity
Typical Applications:
?Radar
?Antennas
?RF couplers
?Filter
?Passive components
?Power amplifier
Corporate Responsibility
