- Business Unit
Interconnect solution
High-frequency high-speed seri
Other solutions
Interconnect solution
High-frequency high-speed seri
Other solutions
Interconnect solution
High-frequency high-speed seri
Other solutions
Features:
?Ceramic/PTFE Microwave Composite
?Lowest Insertion Loss in Class
?“Best-in-Class” Loss Tangent (0.0010)
?Electrical Phase Stability vs.
Temperature
?High Thermal Conductivity
?Tightest Dielectric Constant (±0.03) and Thickness Tolerance
Benefits:
?Excellent Thermal Stability of DK and Df
?Phase Stability vs. temperature
?High Degree of Dimensional
Stability Required for Complex,
Multi-layer Boards
?Excellent CTE in X,Y and Z Directions
Typical Applications:
?Defense Microwave/RF Applications
?Radar
?Phase Fed Array Antennas
?Microwave Feed Networks
?CNI (communication, navigation and identification) Applications
?SIGINT, Satellite & Space Electronics
?Other High Frequency and High Speed Applications
Corporate Responsibility
