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Features:
?Excellent Thermal Coefficient of  Dielectric Constant
?Excellent PIM Performance
?High Thermal Conductivity ideal for  Higher Power Designs.
?Reduced Coefficient of Thermal
Expansion in Z-direction (CTEz)
?Tightest Commercial Laminate DK  Tolerance for Impedance Control

Benefits:
?Low Dielectric Loss (Loss Tangent)
?Low Insertion Loss (S21)
?Excellent Electrical Phase
Stability vs. Temperature
?Excellent Copper Bond Strength
?Low Water Absorption

Typical Applications:
?Base Station Antennas
?Power Amplifiers (PA), Tower Mounted Amplifiers (TMA) and Tower Mounted Booster Amplifiers  (TMB)
?Antenna Feed Networks
?RF Passive Components
?Multimedia Transmission Systems