- Business Unit
Interconnect solution
High-frequency high-speed seri
Other solutions
Interconnect solution
High-frequency high-speed seri
Other solutions
Interconnect solution
High-frequency high-speed seri
Other solutions
Product characteristics:
Ceramic Filling/Teflon Microwave Composites
Minimum insertion loss at the same level
The lowest dielectric loss of the same level
Electron phase stabilization for temperature change
High thermal conductivity
Minimum dielectric constant tolerance (+0.02) and thickness tolerance
Product advantages:
Excellent thermal stability of Dk/Df
Phase stability with temperature
High dimensional stability, suitable for complex design of multi-layer microwave board
Excellent expansion coefficients of x, y, z axes
Typical applications:
Microwave/Radio Frequency Defense Electronic Applications
Radar
- Array antenna
Microwave feeder network
CNI (Communications, Navigation and Recognition) Applications
Communications and Intelligence Systems, Satellites & Space Electronics
High-frequency and high-speed electronic applications
Corporate Responsibility
