- Business Unit
Interconnect solution
High-frequency high-speed seri
Other solutions
Interconnect solution
High-frequency high-speed seri
Other solutions
Interconnect solution
High-frequency high-speed seri
Other solutions
Features:
? “Best in Class” Thermal Conductivity( 0.8 W / m K )
? Dielectric Constant Stability across Wide Temperatures( - 9 pp m / ℃)
? Very Low Loss Tangent provides Higher Amplifier or Antenna Efficiency
? Priced Affordably for Commercial Application
? High Peel Strength for Reliable
Copper Adhesion in thermally stressed applications
? Meet Military Standard for Shock and Impact Resistance Test
Benefits:
? Heat Dissipation and Management
? Improved Processing and Reliability
? Large Panel Sizes for Multiple Circuit Layout for lowered Processing Costs
Typical Applications:
? Power Amplifiers, Filters and Couplers
? Tower Mounted Amplifiers (TMA) and Tower Mounted Boosters (TMB)
? Thermally Cycled Antennas sensitive to dielectric drift
? Microwave Combiner and Power Dividers
Corporate Responsibility
