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RLP30

RLP30 bonding ply, which mainly contained glass cloth, composite resin and special ceramic filler, is a good bonding material for microwave multilayer application. It is suitable for the applications with low dielectric constant and low dissipation requirements, as well as high performance PCB multilayer bond with high frequency and high speed transmission requirements. The press/cure temperature of the RLP30 is 180℃, so it will still be good to use even if PCB shop without high temperature press.