- Business Unit
Interconnect solution
High-frequency high-speed seri
Other solutions
Interconnect solution
High-frequency high-speed seri
Other solutions
Interconnect solution
High-frequency high-speed seri
Other solutions
Glass fiber cloth/PTFE/fine ceramic powder can be added to the laminates for multi-layer PCB. It has unique thermal stability (CTE) and minimal dielectric constant temperature drift, and has the best processability.
Features:
?Excellent Thermal Coefficient of Dielectric Constant
?Excellent PIM Performance
?High Thermal Conductivity ideal for Higher Power Designs.
?Reduced Coefficient of Thermal
Expansion in Z-direction (CTEz)
?Tightest Commercial Laminate DK Tolerance for Impedance Control
Features:
?Extremely Low Loss Tangent (0.0009 @10GHz)
?Excellent Dimensional Stability
?Excellent Product Performance Uniformity
Features:
? “Best in Class” Thermal Conductivity( 0.8 W / m K )
? Dielectric Constant Stability across Wide Temperatures( - 9 pp m / ℃)
? Very Low Loss Tangent provides Higher Amplifier or Antenna Efficiency
? Priced Affordably for Commercial Application
? High Peel Strength for Reliable
Copper Adhesion in thermally stressed applications
? Meet Military Standard for Shock and Impact Resistance Test
Features:
?Ceramic/PTFE Microwave Composite
?Lowest Insertion Loss in Class
?“Best-in-Class” Loss Tangent (0.0010)
?Electrical Phase Stability vs.
Temperature
?High Thermal Conductivity
?Tightest Dielectric Constant (±0.03) and Thickness Tolerance
RA300
Features:
?Ceramic/PTFE Microwave Composite
?Lowest Insertion Loss in Class
?“Best-in-Class” Loss Tangent (0.0011)
?Electrical Phase Stability
?High Thermal Conductivity
?Tightest Dielectric Constant (±0.03) and Thickness Tolerance
Features and Benefits:
?Low dielectric constant ( @10GHz Dk 3.20)and dissipation (@10GHz Df 0.0030)
?High glass transition temperature(Tg 280℃)
?Low press temperature 180℃
?Reliable multiple press characteristics
?Good blind hole filling effect
?Excellent thickness uniformity
Features and Benefits:
?Low Dielectric Loss(0.0013 @10GHz)
?Excellent Mechanical Properties vs. Temperature
?Reliable Strip Line and Multi-layer Board Constructions
?Suitable for Use with Epoxy Glass Multilayer Board Hybrid Designs
?Stable Dielectric Constant vs.
Temperature and Frequency
?Suitable for Applications Sensitive to
Temperature Change
?Excellent Dimensional Stability